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AP3152
120mA HIGH EFFICIENCY WHITE LED DRIVER
Electrical Characteristics
C IN = C OUT = C1 = C2 = 1.0μF; T A = 25°C, V IN = 3.5V. Unless otherwise stated.
Symbol
Description
Conditions
Min
Typ.
Max
Units
1X Mode
I Q
Quiescent Current
Fosc=1.2MHz,
1.2
mA
SDI=HIGH, no load
I SHDN
I DX
I D-Match
T SS
F CLK
Shutdown Current
I SINK Current Accuracy
(Note 4)
Current Matching
(Note 5)
Soft-start Time
Switching Clock Frequency
SDI = 0
I SINK = 20mA
V F : D1=D2=D3=D4
I D = 2, 20mA
-1
-10
1
0.6/1.2/1.8
1
10
5
μA
%
%
ms
MHz
F SSP
V SDI(L)
V SDI(H)
Spread Spectrum
SDI Threshold Low
SDI Threshold High
Enabled
V IN = 2.7V to 5.5V
V IN = 2.7V to 5.5V
1.6
+10
0.4
%
V
V
T SLO
T SHI
f PWM
T PWM
T PLO
T PHI
SDI Low Time
SDI High Time
PWM Frequency (Range 1)
PWM Frequency (Range 2)
PWM Signal Period
PWM Signal Low (LED off)
PWM Signal High (LED on)
0.05
0.05
0.2
20
1/
f PWM -Max
1
1
50
50
1.5
30
1/ f PWM -Min
T PWM – 1
T PWM – 1
μs
μs
KHz
KHz
μs
μs
μs
T OFF
T SEP
I SDI
I SCP
T SD
θ JA
θ JC
Chip Disable (held low)
Interval between SDI
sequences (held high)
SDI Input Leakage
V OUT Short to GND hold
Current
Thermal Shutdown
Temperature
Thermal Resistance1 –
Junction to Ambient
Maximum Thermal
Resistance1 –
Junction to Case
PWM
No PWM
PWM
No PWM
DFN3030-12
(Note 6)
DFN3030-12
(Note 6)
-1
65
512
65
512
500
+150
160
21
100
800
100
800
1
ms
μs
ms
μs
μA
mA
°C
°C/W
°C/W
Notes:
4. Determined by the average current levels of all active channels.
5. Defined as the deviation of any sink current from the average of all active current channels.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
AP3152 Rev. 3
5 of 13
FEBRUARY 2009
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